| 摘要 |
PROBLEM TO BE SOLVED: To reduce the chip size of a semiconductor chip, and to avoid deterioration of the characteristics of the semiconductor chip. SOLUTION: Respective via-holes 2, piercing through a semiconductor substrate 1, are formed in a gate electrode 7, a source electrode 9, and a drain electrode 12. Embedded metal wirings 3, protruding from a rear surface of the semiconductor substrate 1, are provided in the via holes 2, and protruding electrodes are formed by the embedded metal wirings 3. |
