| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device by eliminating the disconnection of a bonding wire that occurs when a high/low-temperature cycle test, etc., is performed. SOLUTION: In this semiconductor device, the electrode of a semiconductor element 1 mounted on a semiconductor element mounting base section 2 is connected to an internal lead 4 through the bonding wire 3. The length of the bonding wire 3 on the internal lead 4 connected with the wire 3 from the front end of the lead 4 is set relatively longer than the minimum length required for wire boding, and at least about 0.5 mm or more is secured as the distance required for reducing the stress that may cause the disconnection of the bonding wire 3 as the distance from the front end of the lead 4 to the wire-bonding position. |
