| 发明名称 |
Multilayer planar antenna has via grounding to buried ground plane at orthogonal connector |
| 摘要 |
A multilayer planar antenna has a substrate with buried ground plane (3) and radiators (21) and second substrate (24) with stripline feed circuit (25) with vias (26, 28) providing earth continuity between the ground plane and a feed circuit connector mount (27) using a Metallized hole (29).
|
| 申请公布号 |
FR2822594(A1) |
申请公布日期 |
2002.09.27 |
| 申请号 |
FR20010003775 |
申请日期 |
2001.03.20 |
| 申请人 |
THOMSON CSF |
发明人 |
LAMOUR FREDERIC;SORAIS DANIEL |
| 分类号 |
H01Q9/04;H01Q21/06;H01R13/646;(IPC1-7):H01Q13/20 |
主分类号 |
H01Q9/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
