发明名称 RESIST PATTERN FORMING METHOD, EXPOSURE DEVICE USING THE SAME, AND RESIST PATTERN AND MICROLENS FORMED BY THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To form a highly accurate resist pattern in a three-dimensional shape. SOLUTION: When the resist pattern in the three-dimensional shape is formed, the two photomasks (1st and 2nd photoresistors 1 and 2) having transmissivity distributions are used, the shape of the pattern is roughly matched with one photomask, and its light is made incident on the 2nd photomask, converted to a final garget intensity distribution, and exposed to the resit. Consequently, even if the range of transmissivity formed on the photomask is arrow or even if the transmissivity variation quantity of one gradation is small, the optimum light intensity distribution can be obtained for the target shape.</p>
申请公布号 JP2002278079(A) 申请公布日期 2002.09.27
申请号 JP20010080817 申请日期 2001.03.21
申请人 RICOH CO LTD 发明人 SATO YASUHIRO
分类号 G02B3/00;G03F1/00;G03F1/70;G03F7/20;(IPC1-7):G03F7/20;G03F1/08 主分类号 G02B3/00
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