发明名称 MANUFACTURING METHOD OF THIN-FILM SEMICONDUCTOR DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a manufacturing method by which a thin-film semiconductor device, having superior transistor characteristics, is manufactured using a low-temperature process. SOLUTION: A manufacturing method of a thin-film semiconductor, having a MIS field effect transistor comprising a gate insulating layer and a gate electrode formed on a semiconductor layer, includes a process, in which after a silicon film 104 (105) comprising a channel part silicon film semiconductor layer has been deposited, the silicon film 104 (105) is subjected to a heat treatment at a temperature which is not higher than 600 deg.C and a process, in which a gate insulating film 106 is formed by ECR-PECVD method; or a process, in which after an amorphous silicon film comprising a channel part has been deposited, an oxygen plasma is applied to the amorphous silicon film before a gate insulating layer is formed; and then the amorphous silicon film is subjected to heat treatment at a temperature which is not higher than 600 deg.C.</p>
申请公布号 JP2002280389(A) 申请公布日期 2002.09.27
申请号 JP20010383514 申请日期 2001.12.17
申请人 SEIKO EPSON CORP 发明人 MIYASAKA MITSUTOSHI;TAMASU RITORU
分类号 G02F1/1368;H01L21/20;H01L21/336;H01L29/786;(IPC1-7):H01L21/336;G02F1/136 主分类号 G02F1/1368
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