| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which is equipped with solder balls excellent in connection reliability after a thermal treatment and its manufacturing method. SOLUTION: An electrolytic nickel alloy plating film, an electroless palladium plating film, and an electrolytic gold plating film are successively formed on a conductor terminal. A wiring board is equipped with the above conductor terminal and a solder ball that has such a certain composition which never increases in shear strength by 10% or above by a thermal treatment and is formed on the above conductor terminal, and a solder ball connection terminal is mounted with a solder ball. A wiring board manufacturing method is that solder paste having composition which hardly increases in shear strength by 10% or above by a thermal treatment is applied onto a board equipped with a conductor terminal successively coated with an electrolytic nickel alloy plating film, an electroless palladium plating film, and an electroless gold plating film and melted into solder balls by heating.
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