| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that, when a plurality of high-frequency circuit elements are housed in the same high-frequency package, an electromagnetic mutual interference occurs between the high-frequency circuit element and, when a cover made of a metal is welded to a frame, a thermal stress is generated at a connecting part of the cover to the frame to bring about a crack, at a pressure reducing time in a high-frequency package when the circuit elements are housed in the package, a warp is generated at the cover and a stress is generated at the connecting part of the cover to the frame by the warp to bring about the crack. SOLUTION: The package for housing the high-frequency circuit elements comprises the cover 2 made of the metal having a ceiling part 2a covering a placing part 1a; and a partition part 2b formed to partition the placing parts 1a by forming a double sidewall vertically suspended from the ceiling part 2a toward a boundary between the placing parts, and formed so as not to contact at a lower end with the upper surface of a base 1 and a bottom plate 2d for coupling the lower ends 3c of respective sidewalls of the double sidewall.
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