| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing substrate by which a solder bump having a flat top face can be formed uniformly and surely regardless of its location by reducing the pressing force applied to the bump at the time of pressing the bump with a pressing surface. SOLUTION: This method of manufacturing substrate includes a flattening step of flattening the top face of the solder bump 13 formed on the main surface 11 of a substrate 10 having the main surface 11 and a rear surface 12 to a flat top face 16, by vertically vibrating the flat pressing surface 234 in the direction parallel to the heightwise direction of the bump 13 while the surface 234 is made to press the top face of the bump 13. In this flattening step, the top face of the bump 13 is formed to the flat top face 16 while the deformation or vibration of the substrate 10 caused by the pressing force or vertical vibration of the surface 234 is suppressed by pressing four corners of the main surface 11 of the substrate 10 with an annular retaining member 255.
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