| 摘要 |
PROBLEM TO BE SOLVED: To improve durability and reliability by surely radiating heat of a semiconductor element. SOLUTION: A semiconductor device comprises an IGBT 9, a circulating diode 12 and the like mounted on the surface of a bus bar electrode 2 via a stress relaxation metal plate 6, and a plurality of slit grooves 3 formed on the rear surface of the electrode 2. An adhesive 4 is coated between a base plate 1 and the electrode 2, and the plate 1 is connected to the electrode 2 in a state that spaces 5 are provided in the grooves 3. Thus, a volatile solvent in the adhesive 4 is evaporated through the spaces 5, and hence the thermal resistance of the adhesive 4 can be reduced. |
