发明名称 METHOD OF MANUFACTURING PRINTED WIRING BOARD FOR ELECTROPHOTOGRAPH
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing printed wiring board for electrophotograph by which circuit patterns can be formed on both surfaces of a printed wiring board for electrophotograph in fogging- and deterioration- free good picture qualities by collectively treating both surfaces of the board at the time of manufacturing the wiring board. SOLUTION: After both surfaces of the printed wiring board for electrophotograph are exposed to light by utilizing photomemory-like photosensitive layers, electrostatic latent images are formed on both surfaces by electrostatically charging the surfaces, and the latent images formed on the surfaces are collectively subjected to liquid development. After development, the excessive liquid left on both surfaces is removed by means of a pair of liquid-absorptive squeezing rollers.
申请公布号 JP2002280707(A) 申请公布日期 2002.09.27
申请号 JP20010077013 申请日期 2001.03.16
申请人 MITSUBISHI PAPER MILLS LTD 发明人 KANEDA YASUO;NAZUKA MASANORI;KITO MASATOSHI
分类号 G03G15/11;G03G15/22;H05K3/06;(IPC1-7):H05K3/06 主分类号 G03G15/11
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