SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To realize a semiconductor package having excellent reliability and hermetic sealability without necessity of sealing by a resin and further good thermal conductivity. SOLUTION: A heat conduction sheet-like material 31 containing at least an inorganic filler of 70 to 95 pts.wt. and a thermosetting resin composition of 5 to 30 pts.wt. and having flexibility in an uncured state is manufactured. Through holes 33 are formed through the material 31, and a conductive resin composition 34 is filled in the holes 33. The material 31 and a semiconductor chip 35 are aligned at positions of the holes 33 of the material 31 and the electrodes of the chip 35 in a planar direction and superposed. The material 31 is cured by heating and pressurizing, and integrated with the chip 35. An externally extracting electrode 30 is formed on the surface of a heat conduction mixture 37 to an opposite side to the chip 35 in a state connected to the composition 34.