发明名称 SUBSTRATE-HOUSING CASE INSERTING/REMOVING SYSTEM
摘要 <p>PROBLEM TO BE SOLVED: To provide a substrate housing case inserting/removing system which can prevent the occurrence of dust, when the system inserts or removes a substrate housing case which houses a prescribed substrate in or from a case-storing device. SOLUTION: This substrate housing case inserting/removing system inserts and removes a reticle housing case 102 is and from a reticle library 103. In this system, covers or coating films 11, made of a Teflon<(> R<)> -based resin are formed on the outer peripheral surfaces of the upper and lower bearings 103a and 103b of the reticle library 103, which come into contact with the lugs 102a of the case 102 and the hardness of the covers or films 11 is made equal to or lower than that of the lugs 102a of the case 102. Consequently, no shave part is generated on the lugs 102a, which are the constituent member of the contacting sections of the reticle housing case 102, and accordingly, no dust is generated in the library 103 nor goes out of the library 103.</p>
申请公布号 JP2002280281(A) 申请公布日期 2002.09.27
申请号 JP20010073441 申请日期 2001.03.15
申请人 SONY CORP 发明人 TSUKAMOTO YASUO
分类号 G03F1/66;G03F7/20;H01L21/027;H01L21/673;H01L21/677;(IPC1-7):H01L21/027;H01L21/68;G03F1/14 主分类号 G03F1/66
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