RESIN COMPOSITION, SOLDERING RESIST RESIN COMPOSITION AND THEIR CURED BODIES

摘要

PROBLEM TO BE SOLVED: To provide a resin composition giving a cured body excellent in flexibility and resistance to the heat of soldering, heat deterioration and electroless gold plating, developable with an organic solvent or a dilute alkali solution and suitable for a soldering resist and for an interlayer dielectric. SOLUTION: The resin composition contains a urethane oligomer (A) which is a reaction product of a diol compound (a) of the formula HO-C2 H4 -S-Cn H2n -S- C2 H4 -OH (where (n) is an integer of 2-10) and a tetracarboxylic acid dianhydride (b) and a polyol compound (c) other than the component (a), an organic polyisocyanate (d) and a hydroxyl-containing (meth)acrylate (e) as optional components and a diluent (B).