发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE DRY FILM RESIST USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in workability and adhesiveness, having satisfactory mechanical strength after curing and excellent in heat resistance, to provide a photosensitive dry film resist using the composition and to provide a photosensitive cover lay film laminated board obtained by laminating the dry film resist on a printed board and exhibiting good solid state properties. SOLUTION: The photosensitive resin composition contains (A) a soluble polyimide having a COOH equivalent of 200-3,000, (B) a polyfunctional (meth) acrylic compound and/or its analogue and (C) a photoreaction initiator. |
申请公布号 |
JP2002278065(A) |
申请公布日期 |
2002.09.27 |
申请号 |
JP20010078201 |
申请日期 |
2001.03.19 |
申请人 |
KANEGAFUCHI CHEM IND CO LTD |
发明人 |
OKADA YOSHIFUMI;KOKAWARA KAORU |
分类号 |
G03F7/037;C08F2/44;C08F2/48;C08F283/04;C08G73/10;G03F7/004;G03F7/075;H05K3/28 |
主分类号 |
G03F7/037 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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