发明名称 ELECTROMAGNETIC WAVE ABSORPTION HEAT CONDUCTING COMPOSITION, THERMAL SOFTNESS ELECTROMAGNETIC WAVE ABSORPTION HEAT-DISSIPATING SHEET AND HEAT-DISSIPATING METHOD
摘要 PROBLEM TO BE SOLVED: To obtain an electromagnetic wave absorption heat conducting composition which is superior in heat-dissipating performance and electromagnetic wave absorbability, and a thermal softness electromagnetic wave absorbent heat-dissipating sheet obtained by forming it into a sheet-like form. SOLUTION: An electromagnetic wave absorption heat conducting composition is a heat conducting composition for forming an electromagnetic wave absorption heat-dissipating member, in which heat generates by operation to be higher than room temperatures, and which is disposed between heat generating electronic components as an electromagnetic wave generation source and heat- dissipating parts. It is non-fluid in a state of room temperatures prior to operation of electronic parts and is converted into low viscosity, softened or melted due to heat generation, when electronic components are operated, so that at least the surface is fluidized. Thus, a gap is filled between the electronic components and the heat-dissipating parts, without substantially an opening gap.
申请公布号 JP2002280207(A) 申请公布日期 2002.09.27
申请号 JP20010080870 申请日期 2001.03.21
申请人 SHIN ETSU CHEM CO LTD 发明人 FUJIKI HIRONAO;TOMARU KAZUHIKO;SAKURAI IKUO;SUZUKI AKIHISA;YOSHIDA KUNIHIKO
分类号 C01G49/00;C08L33/00;H01F1/00;H01L23/06;H01L23/373;H05K7/20;H05K9/00 主分类号 C01G49/00
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