发明名称 |
METHOD FOR MANUFACTURING LEAD FRAME WITH HEAT SINK PLATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a lead frame with a heat sink plate capable of manufacturing the lead frame with the heat sink plate improving productivity and having high reliability. SOLUTION: The method for manufacturing the lead frame with the heat sink plate comprises a heat sink plate separating step of separating the heat sink plate 2 of the heat sink frame 2 from a frame 2B by punching it in a lower region of the lead frame 1, and a connecting step of connecting by caulking the separated plate 2A with a unit lead 1 of the lead frame 1 disposed in an upper region. |
申请公布号 |
JP2002280511(A) |
申请公布日期 |
2002.09.27 |
申请号 |
JP20010074065 |
申请日期 |
2001.03.15 |
申请人 |
MITSUI HIGH TEC INC |
发明人 |
IWAMOTO HISANORI;MATSUOKA HIROSHI;NAKADA YUJI |
分类号 |
H01L23/50;(IPC1-7):H01L23/50 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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