发明名称 METHOD FOR MANUFACTURING LEAD FRAME WITH HEAT SINK PLATE
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a lead frame with a heat sink plate capable of manufacturing the lead frame with the heat sink plate improving productivity and having high reliability. SOLUTION: The method for manufacturing the lead frame with the heat sink plate comprises a heat sink plate separating step of separating the heat sink plate 2 of the heat sink frame 2 from a frame 2B by punching it in a lower region of the lead frame 1, and a connecting step of connecting by caulking the separated plate 2A with a unit lead 1 of the lead frame 1 disposed in an upper region.
申请公布号 JP2002280511(A) 申请公布日期 2002.09.27
申请号 JP20010074065 申请日期 2001.03.15
申请人 MITSUI HIGH TEC INC 发明人 IWAMOTO HISANORI;MATSUOKA HIROSHI;NAKADA YUJI
分类号 H01L23/50;(IPC1-7):H01L23/50 主分类号 H01L23/50
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