HEAT SINK WITH LEGS AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a heat sink suitable for cooling a heater such as a semiconductor element (transistor or a thyristor) or the like mounting on an electronic equipment component. SOLUTION: The heat sink with legs comprises a plurality of fins A2 stood on the surface of a substrate 1, and the legs 3 extended from the substrate 1 by pressing on the rear surface of the substrate 1. The heat sink further comprises a U-shaped cross sectional heat transfer plate 7 having a central part 8 thermally connected to the distal ends 6 of the plurality of fins A2 and distal ends 10 of both side parts 9 thermally connected to the front surface of the substrate 1. Accordingly, the legs can be easily provided. The legs are not removed. Cooling characteristics are improved by thermally connecting the U-shaped heat transfer plate.