| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC memory card, in which the variance of the binding strength of a panel member with a body resin frame is eliminated, the binding force is consistently firm, and the manufacturing cost can be reduced, and to provide a manufacturing method therefor. SOLUTION: A projection part 16 is provided on an end part of a face metal panel 10. The projection part 16 is formed, so that the width of a forward end part is larger than the width of a root part. A groove part 17 for inserting the projection part 16 is formed in the body resin frame 12. A printed circuit board is fixed to the body resin frame 12, and the IC memory card 20 is manufactured, by binding the face and back metal panels 10 and 11 with each other. |
