| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve a problem due to the fact that when a protrusion for bonding a wire extending from a hybrid integrated circuit is formed on the housing thereof, upper end part of the protrusion may be curled depending on the shape of the protrusion or the moving direction of a machining tool and direct bonding to the protrusion becomes difficult. SOLUTION: The hybrid integrated circuit device comprises a circuit board 51, an electronic component 52, and a housing 55 having a fixing part 55c and a protrusion 10 wherein the protrusion 10 has a rectangular flat face 11 being bonded with the forward end of a wire 60, and an inclining face 15 formed at at least one side edge thereof while making a specified angle against the bonding face.</p> |
