| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of picking up chip-type components for surely reducing a contact area between chip-type components and adhesive agent layer of a dicing tape, and for picking up chip-type components, without picking up the components using a pickup stylus. SOLUTION: This chip-type component pickup method comprises a dicing process for dividing and isolating a plate component adhered to a dicing tape including a layer, which is deformed, when it is heated into a plurality of chip- type components; a heating and deforming process for deforming the dicing tape by heating it; a peeling process for accelerating deformation of the dicing tape and peeling the chip-type components from the dicing tape, by attracting the dicing tape with an absorbing member with the rear surface of the dicing tape holding a plurality of chip-type components, provided opposed to the attracting member which can attract the dicing tape; and a pickup process for attracting and grasping the chip-type components with an attracting collet from the upper surface of the chip type component, in order to pickup the components from the dicing tape.</p> |
