| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that the surface height of a wafer W is detected with an above CCD camera B focused on the wafer W surface by moving a main chuck 6 up and down with center at the focus of the CCD camera B to search for the focus, this taking a time for focusing on the wafer W. SOLUTION: The probing method comprises a step of irradiating two specified outside regions of an electrode pad of a wafer W on a main chuck 11 with light, a step of taking out lights reflected from the specified regions to a focus detector 16, a step of pupil-dividing the reflected lights passing through the detector 16 by a pupil dividing mirror 163 into first and second lights, a step of receiving the first and second lights through optical sensors 166 to obtain their respective light quantity distributions, a step of obtaining the defocus quantity from the focus of a second imaging means 13 on the wafer W surface based on the light quantity distributions of the first and second lights, and a step of focusing on the wafer W surface on the main chuck 11 based on the defocus quantity.
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