发明名称 BUS DUCT HOUSING
摘要 PROBLEM TO BE SOLVED: To provide a bus duct housing where water, dust, etc., will not permeate into recesses of the housing, assembling workability is superior, and load of a bonding member to a force which is applied when short-circuited is reduced. SOLUTION: In this bus duct housing 1, a pair of housing chips 12A, 12B which are provided with recesses 10 for accommodating electrical conductor 30 and flanges 11A, 11B arranged on both sides of aperture ends of the recesses 10 are made to face with each other, the flanges 11A, 11B are bonded to each other, and bonding is performed by using the bonding member 19. Seams 11C of end portions of both of the bonded flanges 11A, 11B are covered with fitting parts 13, whose sections have square bracket shapes. In the bus duct housing 1, the fitting parts 13 prevent infiltration of water, dust, etc., into the recesses 10 and share a force which is applied when short-circuited.
申请公布号 JP2002281648(A) 申请公布日期 2002.09.27
申请号 JP20010081346 申请日期 2001.03.21
申请人 SUMIDEN ASAHI INDUSTRIES LTD 发明人 NAKAJIMA TAKASHI;MITSUNAMI NOBUHARU;TAGAMI YOSHIYUKI
分类号 H02B1/20;H02G5/06;H02G5/08;H02G5/10;(IPC1-7):H02G5/08 主分类号 H02B1/20
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