| 摘要 |
PROBLEM TO BE SOLVED: To obtain a tape carrier for semiconductor devices which prevents the excessive deposition of tin on the lead side and has a high reliability. SOLUTION: A nickel layer is provided on an insulation film of a resin such as polyimide resin, and a copper foil is formed on the nickel layer by electrolytic copper plating. The foil is formed into a specified conductor pattern, a gold plating layer is formed on the conductor pattern by electrolytic or electroless plating to cover the nickel layer remaining on the conductor pattern side, and a tin plating layer is formed on the gold plating layer.
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