发明名称 BATCH-TYPE REMOTE PLASMA TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a batch-type remote plasma treatment apparatus. SOLUTION: A pair of electrodes 27, 27, to which a high-frequency power supply 31 is connected, are arranged to be adjacent in a treatment chamber 12 into which a boat 2 holding a plurality of wafers 1 is carried, and both electrodes are covered with a protective tube 25 made of a dielectric. A gas supply pipe 21, made of a dielectric, is arranged between both electrodes in the treatment chamber 12, and a plurality of blow-off ports 23 are opened and installed in the pipe 21. The treatment chamber 12 is heated by a heater 14, is evacuated by an evacuation pipe 16, and the boat 2 is turned by a shaft 19. When high-frequency power is applied across both electrodes, a plasma 40 is formed inside the pipe 21, a treatment gas 41 in the pipe 21 is activated, activated particles 42 are blown off from the blow-off ports 23, and they come into contact with the wafers 1 so as to be plasma-treated. Consequently, the throughput of batch treatment can be enhanced, the plasma damages to the remote plasma treatment apparatus can be prevented, the treatment chamber is heated as a whole, and temperature distribution can be made uniform.
申请公布号 JP2002280378(A) 申请公布日期 2002.09.27
申请号 JP20020003615 申请日期 2002.01.10
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 TOYODA KAZUYUKI;INOKUCHI YASUHIRO;TAKEBAYASHI MOTONARI;KONYA TADASHI;ISHIMARU NOBUO
分类号 C23C16/509;H01L21/302;H01L21/3065;H01L21/31;(IPC1-7):H01L21/31;H01L21/306 主分类号 C23C16/509
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