| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a metal wall package in which leakage from the joint of a ceramic terminal and a metal frame is prevented. SOLUTION: In the metal wall package where a semiconductor element 71 is mounted on a metal basic body 10 and a ceramic terminal 30 electrically conducting through a metal frame 20, while being insulated therefrom, is bonded onto the metal basic body 10 while surrounding a semiconductor 71, a groove 33 is made in the side face of the ceramic terminal 30, a via hole 34 is made substantially in the center of the groove 33, a metallization layer 44 is formed in the entire region of the groove 33 while covering the via hole 34 and the groove 33 is abutted against the end face of a cut 21 made in the metal frame 20 and bonded thereto.</p> |
