发明名称 METHOD FOR MOUNTING ELECTRONIC PART
摘要 PROBLEM TO BE SOLVED: To appropriately inspect each electronic part in a method for mounting electronic parts in which a plurality of electronic parts are mounted on a board to form a circuit by electrically connecting to each other. SOLUTION: A semiconductor chip 20 to be inspected is mounted to a board 10, and is connected to an independent conductive part 13 which is independent without electrically connecting with a capacitor 30 as the other electronic part out of conductors 11 formed on the board 10, and succeedingly a probe pin 40 is put on the independent conductive part 13, so that the semiconductor chip 20 is inspected in an electrically discrete state. Thereafter, the capacitor 30 is mounted and the independent conductive part 13 is electrically connected to the capacitor 30 by use of a solder paste 50 to form a circuit.
申请公布号 JP2002280693(A) 申请公布日期 2002.09.27
申请号 JP20010078871 申请日期 2001.03.19
申请人 DENSO CORP 发明人 TAKENAKA HISANORI
分类号 H05K1/11;H05K3/00;H05K3/40;H05K13/08 主分类号 H05K1/11
代理机构 代理人
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