| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling module capable of enhancing cooling efficiency by forming a structure having no fluid passage at a heat transfer plate side. SOLUTION: The cooling module comprises a semiconductor element 15 to be cooled, a flat plate-like heat transfer plate 16 contacted with the flat surface of the element and having good thermal conductivity, a fluid cover 18 connected to the plate and having a fluid passage, and a partition plate 21 having good thermal conductivity within the passage. Since the plate 16 is in a flat plate-like state, the selection of a material putting importance to only thermal conductivity becomes possible. Thus, heat transfer action can be enhanced, and the heat transfer of a fluid by the plate 21 having good thermal conductivity is expedited. Accordingly, an operation for enhancing a cooling effect is provided. |
