| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed board which is capable of surely restraining a soldering failure such as a solder bridge from occurring independently of a difference in the characteristics of solders. SOLUTION: A plurality of lands is disposed in the direction of transfer in a flow soldering process, a dummy pattern 6 where excessive solder is attached while a solder operation is carried out is provided at the rear of the lands 5, and the dummy pattern is so formed as to have a wide front side 6a which crosses the direction of transfer at right angles and is tapered into a narrow rear side 6b. Especially, the dummy pattern 6 is formed into nearly a triangle whose one side crosses the direction of transfer at right angles and tapered into an apex. By this setup, the solder left on the dummy pattern 6 is reduced in volume, and solder is restrained from moving to the lands due to a reaction that occurs when the solder attached to the dummy pattern is separated from a solder jet, so that a solder bridge is prevented from being produced between the lands.
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