| 发明名称 |
ELECTRONIC APPARATUS, SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE |
| 摘要 |
PROBLEM TO BE SOLVED: To provide a novel electronic apparatus having solder connections, especially, realize solder connections at a high temperature side in a temperature hierarchical connection. SOLUTION: A connection between a semiconductor device, and a substrate is made of metal balls such as Cu balls and a compound of Sn with the metal ball, and the metal balls are connected by the compound. |
| 申请公布号 |
JP2002280396(A) |
申请公布日期 |
2002.09.27 |
| 申请号 |
JP20010376582 |
申请日期 |
2001.12.11 |
| 申请人 |
HITACHI LTD |
发明人 |
SOGA TASAO;SHIMOKAWA HIDEYOSHI;NAKATSUKA TETSUYA;MIURA KAZUMA;NEGISHI MIKIO;NAKAJIMA KOICHI;ENDO TSUNEO |
| 分类号 |
B23K1/00;B23K3/06;B23K35/14;B23K35/22;B23K35/24;B23K35/26;B23K35/28;B23K35/30;B23K101/40;C22C5/02;C22C5/06;C22C9/02;C22C13/00;C22C28/00;H01L21/50;H01L21/52;H01L21/56;H01L21/60;H01L23/10;H01L23/12;H01L23/31;H01L23/36;H01L23/367;H01L23/433;H01L23/485;H01L23/492;H01L23/495;H01L23/50;H05K1/14;H05K3/34 |
主分类号 |
B23K1/00 |
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