| 摘要 |
electrical engineering. SUBSTANCE: device incorporating thermal lag provision has case accommodating movable and fixed contacts and heat-sensing element and provided with heat-taking lid. Contacts are normally closed with fixed contact pressure applied to them. Heat-taking lid has extended thermalcontact surface; heat-sensing element is made of material possessing shape memory effect with preset straightforwardness and its configuration may be different, that is, it may be U- or S-shaped, or made in the form of closed or split ring. In addition case may be made in the form of cylinder with height-to-diameter ratio higher than 2. EFFECT: reduced size, enhanced operating stability. 5 cl, 1 dwg |
