| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical semiconductor device having excellent solder heat resistance, solder re-flow resistance and high reliability without changing the constituting member of a conventional optical semiconductor device by thermally aging in the final step of assembling. SOLUTION: The optical semiconductor device is obtained by mounting an optical semiconductor element of a IIIB-VB compound semiconductor with a resin composition, molding the element with a transparent sealing resin, and then passing the element through a step of aging the element at 80 to 200 deg.C for 8 to 48 hours. |
