| 摘要 |
PROBLEM TO BE SOLVED: To prevent solder from getting into a bonding part and a bonding part for wire bonding in a light-emitting element at the time of mounting an LED device. SOLUTION: Among electrodes 1 and 2 formed on a substrate 4 in the LED device i.e., a bottom electrode of the LED or a bonding part for bonding wire 1a or 2a, device electrodes 1c and 2c provided on both sides of the substrate so as to cover the opposite side of the substrate each other, connection parts 1b and 2b respectively provided between each device electrode and the bonding, the parts 1b and 2b are formed to have a part positioned outside the region of a path connecting the through holes 3 and 3', thereby preventing solder from flowing from the through holes 3 and 3' of the device into the bonding 1a and 2a at the time of mounting. |
