| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper foil having adhesive for manufacturing a printed circuit board which is stable in a wiring resistance, and can form a fine circuit corresponding to high frequencies, and to provide a copper clad laminated board using the same. SOLUTION: A copper foil having adhesive for manufacturing a printed circuit board is provided with an adhesive layer on one surface of a copper foil, and a surface roughness of a copper foil surface coming into contact with the adhesive is 0.5μm or less in Ra, and 1.0μm or less in Rz. The copper foil having adhesive is bonded to the printed circuit board, thereby manufacturing a copper clad board for manufacturing the printed circuit substrate.
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