| 摘要 |
A method for forming a semiconductor device includes steps that provides a lead frame which has a die pad and a plurality of leads extending toward an outside from the die pad, that mounts a semiconductor chip on the die pad, that defines a plurality of inner leads by cutting a predetermined cut portion on the each of the leads locating around the semiconductor chip, and that bonds with a wire between the each of inner leads and the semiconductor chip. Accordingly, the method for forming the semiconductor device can get applicable lead frame for several sizes of a semiconductor chip.
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