| 摘要 |
A negative photosensitive resin composition which comprises an alkali-soluble novolak resin having been subjected to a separation treatment so as to have an weight average molecular weight in terms of polystyrene of 1,000 to 10,000 and to contain the part having a molecular weight less than 500 in an amount of 5 % or less relative to the total resin, a cross-linking agent and an agent generating an acid by a light. The negative photosensitive resin composition exhibits a wide process margin and is excellent in heat resistance, sensitivity, resolution and a pattern shape, and thus can be suitably used as a LCD panel structural material, such as an etching resist, an ion implantation resist, a metal plating resist or a spacer, and an electrode partitioning material for an organo-EL display.
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