| 摘要 |
A novel photosensitive resistive ink composition, comprising (A) a photocurable prepolymer containing at least two ethylenically unsaturated bonds with an alpha,beta-unsaturated carboxylic acid, represented by the general formula [I]. (B) a photocurable monomer containing at least three vinyl groups and an alpha,beta-unsaturated carboxylic acid, represented by the general formula [II](C) a photo-initiator, (D) organic solvents, (E) an epoxy compound containing at least one vinyl group and one epoxy group in the molecule unit represented by the general formula [III](F) a curing agent capable of allowing a photocurable prepolymer (A) undergo a thermal reaction, and (G) a clay nano-compsite. A primary characteristic of this invention is to synthesize a dissolvable epoxy compound (E) which can be reacted completely during the thermosetting to increase heat resistance and cannot cause the transparency of photo-resist film poor due to its crystalline property. The another characteristic of this invention is the adding of the clay nano-composite (G). Because it can be dispersed in nano-meter particle level to increase the surface area of inorganic materials of the resinous composition, the photosensitive resistive ink composition forms a resist coating which is excellent in resistance to heat, resistance to scrape, resistance to moisture absorption and resistance to impact. Moreover, the clay nano-composite has no influence on the brightness and transparency of the composition. The composition produces a solder mask film having a desired pattern after coating, exposure, development and postcuring and excellent in adhesiveness, resistance to chemicals, resistance to insulatiion, resistance to heat, developability, pot life, resistance to electroless gold plating, transparency of the photo-resist film and resolution.
|
