发明名称 Method of manufacturing high aspect ratio photolithographic features
摘要 An etch barrier to be used in a photolithograph process is disclosed. A silicon rich etch barrier is deposited on a substrate using a low energy deposition technique. A diamond like carbon layer is deposited on the silicon rich etch barrier. Photoresist is then placed on this etch barrier DLC combination. To form photolithographic features, successive steps of oxygen and flourine reactive ion etching is used.
申请公布号 US2002136990(A1) 申请公布日期 2002.09.26
申请号 US20010815540 申请日期 2001.03.22
申请人 NGUYEN SON VAN;ROBERTSON NEIL LESLIE;DINAN THOMAS EDWARD;PHAM THAO DUC 发明人 NGUYEN SON VAN;ROBERTSON NEIL LESLIE;DINAN THOMAS EDWARD;PHAM THAO DUC
分类号 G03F7/09;G03F7/40;G11B5/17;G11B5/31;H01L21/033;H01L21/04;(IPC1-7):G03F7/36 主分类号 G03F7/09
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