| 发明名称 |
Seed layer processes |
| 摘要 |
Disclosed is a process flows for treating seed layers including copper such that various problems such as oxidation and insufficient coverage can be repaired in an effective and efficient manner.
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| 申请公布号 |
US2002134684(A1) |
申请公布日期 |
2002.09.26 |
| 申请号 |
US20010001683 |
申请日期 |
2001.10.25 |
| 申请人 |
SHIPLEY COMPANY, L.L.C. |
发明人 |
CALVERT JEFFREY M.;MORRISSEY DENIS;MERRICKS DAVID |
| 分类号 |
C25D7/12;H01L21/288;H01L21/768;H05K3/42;(IPC1-7):C25D5/02;H01L21/445 |
主分类号 |
C25D7/12 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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