| 摘要 |
<p>A system and method for controlling a deposition thickness distributions over a substrate (12). A motor (13) rotates the substrate (12), and at least one sensor (19) senses the deposition thickness of the substrate (12) at two or more radii (25) on the substrate (12). An actuator (20) varies a shadow of a mask (15) disposed over a target (18) used to sputter material on the substrate (12). An ion source (14) generates an ion beam (21) that is directed toward the target (18). The mask (15) is positioned between the ion source (14) and the target (18), and selectively blocks ion current form the ion source (14) from reaching the target (18). A process controller (22) is coupled to the deposition thickness sensor (19) and the actuator (20). In response to the sensed deposition thickness, the process controller (22) varies the shadow of the mask (15) with respect to the target (18) to control the deposition thickness distribution over the substrate (12).</p> |
