发明名称 Layered circuit boards and methods of production thereof
摘要 Compositions and methods are provided whereby printed wiring boards may be produced that comprise a) a substrate layer, and b) a solid, substantially planar optical waveguide laminated onto the substrate layer. The printed wiring board further comprises at least one of a laminating material or a cladding material coupled to the wave-guide, and at least one additional layer coupled to the laminating material or the cladding material.
申请公布号 US2002135991(A1) 申请公布日期 2002.09.26
申请号 US20000752408 申请日期 2000.12.28
申请人 DOI YUTAKA 发明人 DOI YUTAKA
分类号 G02B6/122;G02B6/12;G02B6/43;H05K1/02;(IPC1-7):H05K1/03;H05K1/09 主分类号 G02B6/122
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