| 发明名称 |
Lead frame laminate and method for manufacturing semiconductor parts |
| 摘要 |
A lead frame laminate for use in manufacturing semiconductor parts is provided. A lead frame has an opening and a copper terminal portions formed in the opening. A base material film covers at least the opening and the terminal portions, and laminated on the lead frame through an adhesive layer. The adhesive layer contains a silicone binder and an oxidation inhibitor.
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| 申请公布号 |
US2002136872(A1) |
申请公布日期 |
2002.09.26 |
| 申请号 |
US20020048592 |
申请日期 |
2002.02.01 |
| 申请人 |
FURUTA YOSHIHISA;NABATA NORIKANE;TAKANO HITOSHI |
发明人 |
FURUTA YOSHIHISA;NABATA NORIKANE;TAKANO HITOSHI |
| 分类号 |
C09J7/02;C09J183/04;H01L21/56;H01L23/495;H01L23/50;(IPC1-7):B32B15/08 |
主分类号 |
C09J7/02 |
| 代理机构 |
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