发明名称 |
LIAISON DE PIECES PAR EXPLOSION |
摘要 |
<p>An article of manufacture comprising a beam-leaded semiconductor device. Each beam lead has a quantity of explosive material deposited thereon to facilitate the subsequent explosive bonding of the device to a suitable substrate. The preferred explosive is lead azide and in some embodiments, the beam leads have an undulating or castellated surface to increase the adhesion of the explosive bond.</p> |
申请公布号 |
BE762165(A1) |
申请公布日期 |
1971.07.01 |
申请号 |
BE19710762165 |
申请日期 |
1971.01.28 |
申请人 |
WESTERN ELECTRIC CY. INC., 195, BROADWAY, NEW YORK, N.Y. (E.U.A.), |
发明人 |
B.H. CRANSTON. |
分类号 |
B23K20/08;H01L21/60;H01L21/607;H01L49/02;H01R12/00;(IPC1-7):01L/ |
主分类号 |
B23K20/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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