A work piece carrier head (20) for a CMP or other polishing apparatus is configured to eliminate the slow band associated with the polishing of the surface of a work piece (30). The carrier head (20) includes a wear ring (28) that is positioned circumferentially about the work piece (30) and that together with the work piece (30) is pressed against a moving polishing pad (40). The wear ring (28) is resiliently coupled (32) to the body (22) of the carrier head (20) in a manner to avoid any overturning moment on the ring (28) caused by the frictional force of the polishing pad (40) against the wear ring (28).
申请公布号
WO0202273(A3)
申请公布日期
2002.09.26
申请号
WO2001US20530
申请日期
2001.06.27
申请人
SPEEDFAM-IPEC CORPORATION
发明人
SCHULTZ, STEPHEN, C.;HERB, JOHN, D.;DYER, TIMOTHY, S.