| 摘要 |
EMI shielding at the PCB level comprises, in one embodiment, a box that is open at one side. The box is formed from a material that is substantially opaque to EMI in at least the operating frequency range of the electronic components being shielded. The open side of the box is surrounded by a lip. In use, the EMI shielding is typically received by a housing, and the lip overlies ribs or walls that segment the housing. Such ribs are aligned for contact with a ground track of a PCB. When the PCB is attached to the housing, the lip of the EMI shielding is pressed against the ground track, making electrical connection therewith. The lips are advantageously physically adapted to provide a resilience. In one embodiment, the resilience is imparted by a bend that is used to form the lip. Such resilience promotes reliable electric contact between the lip and the ground track of the PCB. In further embodiments, the lip of each wall is further deformed (e.g., bent, cut, etc.) to provide additional functionality (e.g., a channel for receiving ribs of the housing) or to impart resiliency by way of a plurality of small spring members.
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