发明名称 |
Ink composition for solder resist |
摘要 |
Disclosed is an ink composition for solder resist that includes, as a binder polymer, a styrene-maleic anhydride copolymer of which the maleic anhydride group is partly esterified with a lower alcohol, the ink composition forming a solder resist film excellent in flexibility and hence soldering heat resistance as well as adherence.
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申请公布号 |
US2002137818(A1) |
申请公布日期 |
2002.09.26 |
申请号 |
US20020041506 |
申请日期 |
2002.01.10 |
申请人 |
YU SANG-HYUN;PARK CHAN-HYO;PARK JONG-MIN;PARK HO-JIN |
发明人 |
YU SANG-HYUN;PARK CHAN-HYO;PARK JONG-MIN;PARK HO-JIN |
分类号 |
C09D11/10;G03F7/038;H05K3/28;(IPC1-7):C09D5/00 |
主分类号 |
C09D11/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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