| 发明名称 |
Manufacturing system in electronic devices |
| 摘要 |
A laser processing apparatus comprises a laser oscillator for producing a laser beam to selectively remove part of a substrate to be processed, a scanning system for applying the laser beam to an arbitrary position of the substrate and incident means for applying the laser beam to the substrate substantially at right angle.
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| 申请公布号 |
US2002136971(A1) |
申请公布日期 |
2002.09.26 |
| 申请号 |
US20020092486 |
申请日期 |
2002.03.08 |
| 申请人 |
KABUSHIKI KAISHA |
发明人 |
ITO SHINICHI;HIGASHIKI TATSUHIKO;IKEGAMI HIROSHI;HAYASAKA NOBUO |
| 分类号 |
B23K26/04;G03F7/20;G03F9/00;(IPC1-7):G03F9/00;H01L21/301;G03C5/00;G21G5/00;H01L21/00;C23F1/00 |
主分类号 |
B23K26/04 |
| 代理机构 |
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