| 摘要 |
PURPOSE: A semiconductor package molding apparatus is provided to reduce the quantity of compound supplied to a cavity, by shortening a distance of a compound supply path of a center block. CONSTITUTION: The semiconductor package molding apparatus includes a lower molding die(200) and an upper molding die(100). A cavity in which a leadframe is settled is formed in a chase. The chase is formed at both sides of the center block(271) in which the compound supply paths for introducing the compound, connected to each compound supply paths. A plurality of plunger assemblies are installed under the chase so as to press the compound introduced to each compound supply paths. A plunger plate(230) to which a cylinder(231) for supplying driving force is coupled is formed at both sides of the case. The cylinder is fixed to a clamp plate(210) located under the plunger plate. The clamp plate is increased or decreased by a press apparatus. A fixing plate is fixed to a frame of the molding apparatus. A chase is fixed to the lower portion of the fixing plate. A center block and a cavity are formed to correspond to the lower molding die so that the upper surface of the leadframe is settled on the bottom surface of the chase.
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