| 发明名称 |
METHOD OF MAKING A CIRCUIT BOARD |
| 摘要 |
A method 10, 110 for making multi-layer circuit boards having metallized apertures 38, 40, 130, 132 which may be selectively and electrically grounded and having at least one formed air-bridge 92, 178.
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| 申请公布号 |
US2002136873(A1) |
申请公布日期 |
2002.09.26 |
| 申请号 |
US20010812449 |
申请日期 |
2001.03.20 |
| 申请人 |
LI DELIN;MCMILLAN RICHARD KEITH |
发明人 |
LI DELIN;MCMILLAN RICHARD KEITH |
| 分类号 |
H05K3/00;H05K3/06;H05K3/40;H05K3/42;H05K3/44;H05K3/46;(IPC1-7):H05K1/11;B32B3/00;H05K3/10;B32B15/00 |
主分类号 |
H05K3/00 |
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