| 摘要 |
A connecting device (13), such as for connecting an electronic component (10) to a heat sink (12), or connecting any two objects, includes a thermally activated adhesive (202a) with a local heating element (200) placed in contact therewith. The local heating element (200), such as a wire, may be embedded within the thermally activated adhesive (202a), which may be in sheet form or non-sheet form. When the local heating element (200) is activated, the local heating element cures the adhesive (such as epoxy) within the thermally activated adhesive that is adjacent to the local heating element when, for example, current is passed through the local heating element (200).
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