发明名称 MULTILAYERED PACKAGING MATERIALS FOR ELECTROSTATIC APPLICATIONS
摘要 <p>A multi-layer structure comprises at least one electrostatic dissipative outer layer and a conductive core layer. The outer layer comprises a material selected from the group consisting of an inherently dissipative polymer, an inherently dissipative polymer blended with a non-conductive matrix polymer, an inherently conductive polymer blended with a non-conductive matrix polymer in an amount sufficient to impart a surface resistivity of greater than 105 and less than 1012 ohms/square, and mixtures thereof. The core layer comprises a material selected from the group consisting of an inherently conductive polymer, an inherently conductive polymer blended with a non-conductive matrix polymer, a conductive filler blended with a non-conductive matrix polymer, and mixtures thereof. The multi-layer structure has unexpected improved electrical properties over prior art structures because the surface resistivity of the outer layer in the multi-layer structure is less than the surface resistivity of the outer layer alone or in another multi-layer structure absent contact with the core layer.</p>
申请公布号 WO2002074534(A1) 申请公布日期 2002.09.26
申请号 US2002006960 申请日期 2002.03.07
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